{"id":119,"date":"2021-08-09T14:57:33","date_gmt":"2021-08-09T18:57:33","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/amsv\/?p=119"},"modified":"2026-03-27T09:02:25","modified_gmt":"2026-03-27T13:02:25","slug":"a-practical-approach-to-utilizing-the-open-model-interface-omi-in-aging-analyses-for-long-term-reliability-validation","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/cicv\/2021\/08\/09\/a-practical-approach-to-utilizing-the-open-model-interface-omi-in-aging-analyses-for-long-term-reliability-validation\/","title":{"rendered":"A Practical Approach to Utilizing the Open Model Interface (OMI) in Aging Analyses for Long Term Reliability Validation"},"content":{"rendered":"\n<p><\/p>\n\n\n\n<p>Long term reliability has always been a focus for the automotive industry but is now expanding to include other application areas, such as mobile communication and IoT. When designing ICs for these applications, long term reliability validation has become an integral step in the verification process. To satisfy their customer\u2019s needs for accurate aging simulations, foundries face the requirement to provide corresponding aging models for accurate simulation of device degradation over time.<\/p>\n\n\n\n<p><a href=\"https:\/\/www.eas.iis.fraunhofer.de\/en.html\" target=\"_blank\" rel=\"noopener\">Fraunhofer IIS\/EAS<\/a> and <a href=\"https:\/\/eda.sw.siemens.com\/en-US\" target=\"_blank\" rel=\"noopener\">Siemens EDA<\/a> are working together to ensure mutual customers can take advantage of running aging simulations using Siemens EDA\u2019s <a href=\"https:\/\/eda.sw.siemens.com\/en-US\/ic\/analog-fastspice\/\" target=\"_blank\" rel=\"noopener\">Analog FastSPICE (AFS) Platform<\/a> through models enabled by the new <a href=\"https:\/\/si2.org\/cmc\/\" target=\"_blank\" rel=\"noopener\">CMC<\/a> industry standard <a href=\"https:\/\/si2.org\/open-model\/\" target=\"_blank\" rel=\"noopener\">Open Model Interface (OMI)<\/a>. In this presentation, we will discuss aging challenges, history and benefits of OMI, and the methodology needed to successfully utilize this new standard.<\/p>\n\n\n\n<p>Interested in learning more about the CMC industry standard OMI using Siemens EDA Analog FastSPICE Platform?&nbsp; If yes, <a href=\"https:\/\/eda.sw.siemens.com\/en-US\/\" target=\"_blank\" rel=\"noopener\">Siemens EDA<\/a> is hosting a live web seminar on Wednesday, September 8<sup>th <\/sup>that you will want to attend.<\/p>\n\n\n\n<p>&nbsp;<a href=\"https:\/\/event.on24.com\/eventRegistration\/EventLobbyServlet?target=reg20.jsp&amp;referrer=&amp;eventid=3358010&amp;sessionid=1&amp;key=35167EE1A2FC011548CAC29651AE8E2B&amp;regTag=&amp;V2=false&amp;sourcepage=register\" target=\"_blank\" rel=\"noopener\">Find out more and register today!<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Long term reliability has always been a focus for the automotive industry but is now expanding to include other application&#8230;<\/p>\n","protected":false},"author":75911,"featured_media":52,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[1],"tags":[311,300,301,308],"industry":[],"product":[],"coauthors":[323],"class_list":["post-119","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","tag-ams-blogs","tag-analog-verification","tag-mixed-signal-verification","tag-spice-simulation"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/58\/2021\/03\/IC-in-hand-with-IC-layout-behind-Adobe-80036215-scaled.jpg","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/posts\/119","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/users\/75911"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/comments?post=119"}],"version-history":[{"count":3,"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/posts\/119\/revisions"}],"predecessor-version":[{"id":123,"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/posts\/119\/revisions\/123"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/media\/52"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/media?parent=119"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/categories?post=119"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/tags?post=119"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/industry?post=119"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/product?post=119"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/coauthors?post=119"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}