{"id":1005,"date":"2024-09-12T15:50:08","date_gmt":"2024-09-12T19:50:08","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/cicv\/?p=1005"},"modified":"2026-03-27T09:03:54","modified_gmt":"2026-03-27T13:03:54","slug":"redefining-high-sigma-verification-at-dac","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/cicv\/2024\/09\/12\/redefining-high-sigma-verification-at-dac\/","title":{"rendered":"Redefining High-Sigma Verification: Reflections on Presenting AI-Powered Methodologies at DAC 2024"},"content":{"rendered":"\n<p>This year, I had the privilege of presenting at the 2024 Design Automation Conference (DAC), which took place in San Francisco, California. DAC has always been a hub for innovation, offering the opportunity for engineers, developers, and industry leaders to showcase advancements that push the boundaries of chip design and electronic systems. It was a perfect stage for my co-presenter, Chengcheng Liu from Nvidia, and me to introduce our work titled <em>&#8220;<a href=\"https:\/\/61dac.conference-program.com\/presentation\/?id=FED028&amp;sess=sess192\" target=\"_blank\" rel=\"noreferrer noopener\">AI-powered high-sigma verification methodology for standard cells.<\/a>&#8220;<\/em><\/p>\n\n\n\n<p>As chip designs scale, relying on Monte Carlo simulations and past experiences to predict worst-case Process, Voltage, and Temperature (PVT) corners often proves unreliable. Our presentation introduced an AI-driven, automated methodology, leveraging Siemens\u2019 Solido Design Environment. Solido PVTMC Verifier and Solido High-Sigma Verifier, used by NVIDIA engineering team, demonstrated unprecedented improvements in both accuracy and runtime.<\/p>\n\n\n\n<p>One key highlight was our work with latch-based D flip-flop circuits, where Solido High-Sigma Verifier achieved a 2,500,000X runtime improvement over traditional brute-force methods, verifying failure modes with only 4,000 simulations. Additionally, we achieved 6.322 sigma verification for target cells, with a 30X speedup in runtime.<\/p>\n\n\n\n<p>To learn more about <strong>Solido Design Environment<\/strong> technologies, visit\u00a0<a href=\"https:\/\/eda.sw.siemens.com\/en-US\/ic\/solido\/design-environment\/\" target=\"_blank\" rel=\"noopener\">https:\/\/eda.sw.siemens.com\/en-US\/ic\/solido\/design-environment\/<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>This year, I had the privilege of presenting at the 2024 Design Automation Conference (DAC), which took place in San&#8230;<\/p>\n","protected":false},"author":98995,"featured_media":1007,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[1,5],"tags":[300,331,469,330],"industry":[],"product":[235],"coauthors":[476],"class_list":["post-1005","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","category-events","tag-analog-verification","tag-high-sigma-analysis","tag-solido-design-environment","tag-variation-aware-verification","product-solido"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/58\/2024\/09\/AI-Powered-High-Sigma-Automated-Full-Library-Verification-Methodology-for-Standard-Cells-2.png","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/posts\/1005","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/users\/98995"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/comments?post=1005"}],"version-history":[{"count":2,"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/posts\/1005\/revisions"}],"predecessor-version":[{"id":1008,"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/posts\/1005\/revisions\/1008"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/media\/1007"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/media?parent=1005"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/categories?post=1005"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/tags?post=1005"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/industry?post=1005"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/product?post=1005"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/coauthors?post=1005"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}