{"id":3460,"date":"2025-08-12T16:05:11","date_gmt":"2025-08-12T20:05:11","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/calibre\/?p=3460"},"modified":"2026-03-26T16:24:12","modified_gmt":"2026-03-26T20:24:12","slug":"revolutionizing-3d-ic-design-with-integrated-multiphysics-verification","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/calibre\/2025\/08\/12\/revolutionizing-3d-ic-design-with-integrated-multiphysics-verification\/","title":{"rendered":"Revolutionizing 3D IC design with integrated multiphysics verification"},"content":{"rendered":"\n<p>By Yoyo Li<\/p>\n\n\n\n<p>The semiconductor landscape is always evolving\u2014sometimes quietly, sometimes at breakneck pace. Today, as integrated circuit designs progress from established 2D layouts to sophisticated 3D architectures, new challenges and opportunities are emerging for silicon engineers. These new architectures are not just denser and more powerful; they also unlock entirely new forms of inter-layer electrical, thermal and mechanical interaction. Success in this new world depends on more than incremental improvements\u2014it requires an integrated, system-level, multiphysics verification approach.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Beyond the boundaries of 2D: Why 3D ICs need a new verification mindset<\/h2>\n\n\n\n<p>Historically, the industry thrived on 2D process scaling and established verification flows. 2D methodologies defined the rules for decades, giving engineers predictable tools and workflows. However, escalating performance, power and bandwidth demands\u2014and the onset of system-in-package and heterogeneous integration\u2014are now pushing chipmakers toward breakthroughs in 3D integration.<\/p>\n\n\n\n<p>The shift to 3D is about more than stacking dies. It involves:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Routing high-speed signals vertically and horizontally across different substrates<\/li>\n\n\n\n<li>Managing heat threats from localized power densities<\/li>\n\n\n\n<li>Balancing stress profiles to protect delicate structures<\/li>\n\n\n\n<li>Validating heterogeneous assemblies\u2014often built with dies on differing process nodes<\/li>\n<\/ul>\n\n\n\n<p>Each of these aspects introduces complex failure modes. These cannot be captured by legacy approaches. Addressing these challenges requires solutions that fully embrace the realities of multiphysics design and verification.<\/p>\n\n\n\n<p>Learn more in our latest technical paper, <strong><a href=\"https:\/\/resources.sw.siemens.com\/en-US\/technical-paper-a-comprehensive-approach-to-3d-ic-physical-verification-drc-lvs-and-beyond\/\" target=\"_blank\" rel=\"noreferrer noopener\">A comprehensive approach to 3D IC physical verification: DRC, LVS and beyond<\/a>.<\/strong><\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Siemens EDA: Redefining multiphysics verification<\/h2>\n\n\n\n<p>Siemens Digital Industries Software (Siemens EDA) recognized these evolving needs and invested in building a cohesive, extensible 3D IC verification ecosystem. This includes:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><a href=\"https:\/\/eda.sw.siemens.com\/en-US\/ic\/calibre-design\/physical-verification\/3dstack\/\" target=\"_blank\" rel=\"noreferrer noopener\"><strong>Calibre 3DStack<\/strong><\/a>: For full 3D DRC, LVS and connectivity<\/li>\n\n\n\n<li><a href=\"https:\/\/eda.sw.siemens.com\/en-US\/ic\/calibre-design\/3dthermal\/\" target=\"_blank\" rel=\"noreferrer noopener\"><strong>Calibre 3DThermal<\/strong><\/a>: Advanced thermal simulation<\/li>\n\n\n\n<li><a href=\"https:\/\/eda.sw.siemens.com\/en-US\/ic\/calibre-design\/calibre-3d-ic\/3dstress\/\" target=\"_blank\" rel=\"noreferrer noopener\"><strong>Calibre 3DStress<\/strong><\/a>: Package and transistor-level mechanical analysis<\/li>\n\n\n\n<li><a href=\"https:\/\/eda.sw.siemens.com\/en-US\/ic\/mpower\/\" target=\"_blank\" rel=\"noreferrer noopener\"><strong>mPower power integrity<\/strong><\/a>: EM\/IR integrity analysis<\/li>\n<\/ul>\n\n\n\n<p>Together, these tools extend beyond the capabilities of siloed domain solvers, enabling deep, accurate and early assessment of 3D multiphysics risks\u2014saving time and reducing late-stage surprises.<\/p>\n\n\n\n<p>The Calibre 3D IC solutions are part of the larger Siemens EDA 3D IC portfolio (figure 1).<\/p>\n\n\n\n<figure class=\"wp-block-image size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"858\" height=\"485\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/50\/2025\/08\/image.jpeg\" alt=\"Infographic showing Siemens EDA solutions for 3D IC design, including tools for package and SoC design, multiphysics analysis, verification and system-level solutions across the entire design and integration flow.\" class=\"wp-image-3463\" srcset=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/50\/2025\/08\/image.jpeg 858w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/50\/2025\/08\/image-600x339.jpeg 600w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/50\/2025\/08\/image-768x434.jpeg 768w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/50\/2025\/08\/image-395x222.jpeg 395w\" sizes=\"auto, (max-width: 858px) 100vw, 858px\" \/><figcaption class=\"wp-element-caption\">Figure 1. The Siemens EDA 3D IC portfolio includes tools for package and SoC design, multiphysics analysis, verification and system-level solutions across the entire design and integration flow.<\/figcaption><\/figure>\n\n\n\n<p><\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Mastering complexity: A deeper look at Calibre 3DStack<\/h2>\n\n\n\n<p>In 3D IC design, design rule checking (DRC) and layout versus schematic (LVS) are critical verification steps that ensure the manufacturability and electrical correctness of the design. With the growing influence of multiphysics effects, these checks must be performed alongside additional analyses of thermal and stress domains, providing a holistic view of project risks and performance. Calibre 3DStack empowers designers by:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Handling giga scale GDS and netlist datasets with hierarchical processing<\/li>\n\n\n\n<li>Enabling consistent DRC\/LVS checking across multiple process nodes and technologies<\/li>\n\n\n\n<li>Integrating with Siemens<strong> <a href=\"https:\/\/eda.sw.siemens.com\/en-US\/ic-packaging\/innovator3d-ic\/\" target=\"_blank\" rel=\"noreferrer noopener\">Innovator 3D IC Integrator<\/a><\/strong> for seamless design data hand-off<\/li>\n\n\n\n<li>Implementing fan-out design layout by Xpedition and SoC design layout by Aprisa<\/li>\n\n\n\n<li>Generating precise, actionable error reports that speed up closure<\/li>\n<\/ul>\n\n\n\n<p>DRC\/LVS and interconnectivity requirements are enforced not just at the die level, but also at every interface\u2014across chiplets, interposers and package surfaces. This holistic approach significantly reduces risk.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Precision thermal modeling with Calibre 3DThermal<\/h2>\n\n\n\n<p>Thermal issues can erode performance and reliability in stacked dies. Traditional lumped models often miss subtle interactions. Calibre 3DThermal introduces:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Hierarchy-aware, instance-level power mapping from RTL through implementation<\/li>\n\n\n\n<li>Accurate materials mapping to capture the effects of die thinning, underfill and advanced packaging<\/li>\n\n\n\n<li>Solver acceleration via integration with<strong> <a href=\"https:\/\/plm.sw.siemens.com\/en-US\/simcenter\/fluids-thermal-simulation\/flotherm\/\" target=\"_blank\" rel=\"noreferrer noopener\">Simcenter Flotherm<\/a><\/strong><\/li>\n<\/ul>\n\n\n\n<p>Calibre 3DThermal enables teams to iteratively explore thermal gradients and adjust floorplans, block placements, or cooling solutions\u2014lowering design risk and optimizing for both yield and long-term system health. Figure 2 shows the thermal results after simulation in Calibre 3DThermal, along with a composite materials map and a power map.<\/p>\n\n\n\n<figure class=\"wp-block-image size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"936\" height=\"412\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/50\/2025\/08\/image.jpg\" alt=\"\" class=\"wp-image-3464\" srcset=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/50\/2025\/08\/image.jpg 936w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/50\/2025\/08\/image-600x264.jpg 600w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/50\/2025\/08\/image-768x338.jpg 768w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/50\/2025\/08\/image-900x396.jpg 900w\" sizes=\"auto, (max-width: 936px) 100vw, 936px\" \/><figcaption class=\"wp-element-caption\">Figure 2. Triple panel showing thermal simulation outputs. Screenshots display a Calibre interface with options for Thermal map, Composite map and Power map, each showing distinct color-coded visual data and corresponding bar graphs.<\/figcaption><\/figure>\n\n\n\n<p><\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Mechanical reliability with Calibre 3DStress<\/h2>\n\n\n\n<p>Modern packages involving through-silicon vias (TSVs), copper pillars and non-planar dies face unique mechanical risks. Calibre 3DStress empowers designers and packaging experts to:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Simulate die warpage, thermal expansion and piezoresistive effects during early floor planning<\/li>\n\n\n\n<li>Visualize risk at both the block and device level\u2014down to the transistor<\/li>\n\n\n\n<li>Enable what-if analysis to optimize die stacking orders, materials and bump layouts<\/li>\n<\/ul>\n\n\n\n<p>Conducting stress analysis early can mitigate package-induced failures, reduce overdesign and prevent loss of yield. Full-chip and block-level visualizations reveal potential hotspot locations, allowing design teams to proactively address mechanical reliability concerns and make informed trade-offs (figure 3).<\/p>\n\n\n\n<figure class=\"wp-block-image size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"1330\" height=\"564\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/50\/2025\/08\/fig3-warpage.jpg\" alt=\"\" class=\"wp-image-3466\" srcset=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/50\/2025\/08\/fig3-warpage.jpg 1330w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/50\/2025\/08\/fig3-warpage-600x254.jpg 600w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/50\/2025\/08\/fig3-warpage-1024x434.jpg 1024w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/50\/2025\/08\/fig3-warpage-768x326.jpg 768w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/50\/2025\/08\/fig3-warpage-900x382.jpg 900w\" sizes=\"auto, (max-width: 1330px) 100vw, 1330px\" \/><figcaption class=\"wp-element-caption\">Figure 3. Side-by-side images. Left: Full-chip view displaying hot spots and temperature gradients in purple, yellow and red. Right: Block-level or regional map focusing on a high-temperature area in red within a grid.<\/figcaption><\/figure>\n\n\n\n<p><\/p>\n\n\n\n<p>Learn more about <a href=\"https:\/\/blogs.sw.siemens.com\/calibre\/2025\/07\/16\/navigating-3d-ic-stress-physical-realities-and-best-practices-for-3d-ic-reliability\/\" target=\"_blank\" rel=\"noreferrer noopener\"><strong>Navigating 3D IC stress: physical realities and best practices for 3D IC reliability.<\/strong><\/a><\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Addressing EM and IR drop in dense 3D systems<\/h2>\n\n\n\n<p>Electromigration and IR drop are rapidly escalating concerns as more current flows through thinner interconnects. The Calibre mPower solution provides:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Automated current density extraction across 3D pathways, interposers, TSVs and redistribution layers<\/li>\n\n\n\n<li>Visualization tools to immediately relate EM\/IR risk back to physical design, as shown in figure 4<\/li>\n\n\n\n<li>Data-driven optimization to help teams balance performance and reliability across operating conditions<\/li>\n<\/ul>\n\n\n\n<figure class=\"wp-block-image size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"731\" height=\"411\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/50\/2025\/08\/image-1.jpeg\" alt=\"\" class=\"wp-image-3462\" srcset=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/50\/2025\/08\/image-1.jpeg 731w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/50\/2025\/08\/image-1-600x337.jpeg 600w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/50\/2025\/08\/image-1-395x222.jpeg 395w\" sizes=\"auto, (max-width: 731px) 100vw, 731px\" \/><figcaption class=\"wp-element-caption\">Figure 4. Screenshot of mPower graphical user interface. The window shows four quadrants: layout, dynamic IR drop, power EM ratio and signal EM ratio, each with color-coded data. The side panel includes measurement tools and color legend.<\/figcaption><\/figure>\n\n\n\n<p><\/p>\n\n\n\n<p><strong>Learn more about mPower in this brief <a href=\"https:\/\/resources.sw.siemens.com\/en-US\/video-siemens-mpower-overview\/\" target=\"_blank\" rel=\"noreferrer noopener\">overview video.<\/a><\/strong><\/p>\n\n\n\n<h2 class=\"wp-block-heading\">From isolated analysis to integrated, team-based workflows<\/h2>\n\n\n\n<p>One of Siemens&#8217; biggest advantages is cross-flow integration. Modern 3D IC projects are team sports, requiring constant communication among silicon architects, package designers and reliability engineers\u2014sometimes spread across regions and organizations.<\/p>\n\n\n\n<p>With Calibre\u2019s interoperable environment:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Design and verification data can be shared and probed interactively across all domains<\/li>\n\n\n\n<li>Schedule risks and design closure bottlenecks are minimized<\/li>\n\n\n\n<li>Automated report generation, process-specific rule decks and result databases provide transparency and audit trails for management<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\">Building the future of 3D IC: Reliability, speed, confidence<\/h2>\n\n\n\n<p>From system ideation through bring-up, 3D IC verification with Siemens EDA enables:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Proactive detection of multiphysics issues<\/li>\n\n\n\n<li>Accelerated design closure with fewer spins<\/li>\n\n\n\n<li>Higher confidence across design and manufacturing teams<\/li>\n<\/ul>\n\n\n\n<p>By embedding multiphysics analysis into every stage of the flow, you save time, improve reliability and empower teams to focus on innovation.<\/p>\n\n\n\n<figure class=\"wp-block-image size-full\"><a href=\"https:\/\/resources.sw.siemens.com\/en-US\/contact-eda\/\" target=\"_blank\" rel=\" noreferrer noopener\"><img loading=\"lazy\" decoding=\"async\" width=\"728\" height=\"90\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/50\/2025\/08\/3D-IC-schedule-a-demo.jpeg\" alt=\"\" class=\"wp-image-3465\" srcset=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/50\/2025\/08\/3D-IC-schedule-a-demo.jpeg 728w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/50\/2025\/08\/3D-IC-schedule-a-demo-600x74.jpeg 600w\" sizes=\"auto, (max-width: 728px) 100vw, 728px\" \/><\/a><\/figure>\n\n\n\n<p><\/p>\n","protected":false},"excerpt":{"rendered":"<p>By Yoyo Li The semiconductor landscape is always evolving\u2014sometimes quietly, sometimes at breakneck pace. Today, as integrated circuit designs progress&#8230;<\/p>\n","protected":false},"author":71645,"featured_media":3463,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[1,942],"tags":[943,941,924,312,873,313,862,372],"industry":[],"product":[90],"coauthors":[712],"class_list":["post-3460","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","category-3d-ic","tag-3dstack","tag-3dstress","tag-3dthermal","tag-ic-design","tag-ic-packaging","tag-ic-verification","tag-mpower","tag-physical-verification","product-calibre"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/50\/2025\/08\/image.jpeg","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/posts\/3460","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/users\/71645"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/comments?post=3460"}],"version-history":[{"count":3,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/posts\/3460\/revisions"}],"predecessor-version":[{"id":3469,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/posts\/3460\/revisions\/3469"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/media\/3463"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/media?parent=3460"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/categories?post=3460"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/tags?post=3460"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/industry?post=3460"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/product?post=3460"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/coauthors?post=3460"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}