{"id":2320,"date":"2021-11-29T13:00:50","date_gmt":"2021-11-29T18:00:50","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/calibre\/?p=2320"},"modified":"2026-03-26T16:21:15","modified_gmt":"2026-03-26T20:21:15","slug":"tsmc-oip-forum-celebrates-collaboration-and-innovationand-we-have-the-awards-to-prove-it","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/calibre\/2021\/11\/29\/tsmc-oip-forum-celebrates-collaboration-and-innovationand-we-have-the-awards-to-prove-it\/","title":{"rendered":"TSMC OIP Forum celebrates collaboration and innovation\u2026and we have the awards to prove it!"},"content":{"rendered":"\n<p>TSMC\u2019s Open Innovation Platform\u00ae (OIP) brings together the creative thinking of customers and partners with the common goal of shortening design time, time-to-volume, time-to-market, and ultimately, time-to-revenue. Every year, that collaborative process is on display at the TSMC OIP Ecosystem Forum, as TSMC and its many partners and customers come together to present and celebrate their successes.<\/p>\n\n\n\n<p>One exciting part of the event is always the announcement of the <a href=\"https:\/\/pr.tsmc.com\/english\/news\/2875\" target=\"_blank\" rel=\"noreferrer noopener\">TSMC OIP Partner of the Year awards<\/a> for those companies who, in cooperation with TSMC, achieved outstanding performance in design, development, and technology innovation. The recognition is highly sought-after, and we\u2019re proud to say that Siemens EDA, as a part of Siemens Digital Industries Software, received three Partner of the Year awards in 2021:<\/p>\n\n\n\n<p><strong>EDA Alliance Awards<\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\"><li>Joint Development of 4nm Design Infrastructure, for the optimization of our Calibre\u00ae nmPlatform software and Analog FastSPICE Platform<\/li><li>Joint Development of 3DFabricTM Design Solution, for collaboration on our Xpedition\u2122 Substrate Integrator, Xpedition Package Designer, HYPERLYNX\u2122, Calibre 3DStack\/nmDRC\/nmLVS\/xACT and Tessent\u2122 solutions<\/li><\/ul>\n\n\n\n<p><strong>Cloud Alliance<\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\"><li>Joint Development of Cloud-Based Productivity Solution, for our Calibre nmDRC solution<\/li><\/ul>\n\n\n\n<p>These awards add to the full complement of TSMC partner awards we have received over the years. Pictured here with this year\u2019s awards, as well as some of the many other TSMC Partner awards given to Siemens EDA over the years, is Juan Rey, vice president of Calibre engineering. His leadership of the Calibre engineering team is a significant reason that the Calibre team has been the recipient of so many TSMC awards!<\/p>\n\n\n\n<p>Of course, as pleased as we are by the recognition at this year\u2019s TSMIC OIP Forum, we are already hard at work on new technology and software to <a href=\"https:\/\/www.plm.automation.siemens.com\/global\/en\/our-story\/newsroom\/siemens-tsmc-oip-award\/103203\" target=\"_blank\" rel=\"noreferrer noopener\">continue delivering industry-leading EDA tools and solutions<\/a> to the semiconductor community. Siemens EDA recognizes that today\u2019s challenges are tomorrow\u2019s solutions, and we are committed to ensuring that promise of tomorrow for our customers.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>TSMC\u2019s Open Innovation Platform\u00ae (OIP) brings together the creative thinking of customers and partners with the common goal of shortening&#8230;<\/p>\n","protected":false},"author":71645,"featured_media":2322,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[1],"tags":[379,350,520],"industry":[],"product":[90],"coauthors":[712],"class_list":["post-2320","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","tag-calibre-xact","tag-drc","tag-lvs","product-calibre"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/50\/2021\/11\/Juan-OIP-awards-4-scaled.jpg","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/posts\/2320","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/users\/71645"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/comments?post=2320"}],"version-history":[{"count":2,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/posts\/2320\/revisions"}],"predecessor-version":[{"id":2324,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/posts\/2320\/revisions\/2324"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/media\/2322"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/media?parent=2320"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/categories?post=2320"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/tags?post=2320"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/industry?post=2320"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/product?post=2320"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/coauthors?post=2320"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}