{"id":2124,"date":"2021-03-03T18:05:43","date_gmt":"2021-03-03T23:05:43","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/calibre\/?p=2124"},"modified":"2026-03-26T16:20:32","modified_gmt":"2026-03-26T20:20:32","slug":"spie-ing-at-a-distance","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/calibre\/2021\/03\/03\/spie-ing-at-a-distance\/","title":{"rendered":"SPIE-ing at a distance\u2026"},"content":{"rendered":"\n<p>The SPIE Advanced Lithography Digital Forum took place Feb 22-26, and of course, Siemens EDA was there! We wouldn\u2019t miss one of the premier events for the lithography community, even if we did have to attend from our home offices this year. In addition to listening to keynote speakers discuss challenges in the industry, our own experts were busy presenting new solutions across a wide range of topics, including optical and EUV lithography, patterning technologies, metrology, process integration for semiconductor manufacturing, and more.<\/p>\n\n\n\n<p>Siemens EDA staff authored or co-authored eight papers:<\/p>\n\n\n\n<ul class=\"wp-block-list\"><li><a href=\"https:\/\/www.spiedigitallibrary.org\/conference-proceedings-of-spie\/11611\/1161112\/Better-prediction-on-patterning-failure-mode-with-hotspot-aware-OPC\/10.1117\/12.2583837.full\" target=\"_blank\" rel=\"noreferrer noopener\">Better prediction on patterning failure mode with hotspot aware OPC modeling<\/a><\/li><li><a href=\"https:\/\/www.spiedigitallibrary.org\/conference-proceedings-of-spie\/11613\/116130B\/A-study-on-various-curvilinear-data-representations-and-their-impact\/10.1117\/12.2588374.full\" target=\"_blank\" rel=\"noreferrer noopener\">A study on various curvilinear data representations and their impact on mask manufacturing flow<\/a><\/li><li><a href=\"https:\/\/www.spiedigitallibrary.org\/conference-proceedings-of-SPIE\/11613.toc#ResistModelingandComputationalLithography\" target=\"_blank\" rel=\"noreferrer noopener\">Fast rigorous modeling of photoresist in lithography<\/a><\/li><li><a href=\"https:\/\/www.spiedigitallibrary.org\/conference-proceedings-of-spie\/11613\/116130M\/Advanced-ILT-solutions-to-manufacture-photonics-designs\/10.1117\/12.2585172.full\" target=\"_blank\" rel=\"noreferrer noopener\">Advanced ILT solutions to manufacture Si-photonics designs<\/a><\/li><li><a href=\"https:\/\/www.spiedigitallibrary.org\/conference-proceedings-of-spie\/11614\/116140A\/A-quantified-approach-of-dataset-selection-for-training-ML-models\/10.1117\/12.2586265.full\" target=\"_blank\" rel=\"noreferrer noopener\">A quantified approach of dataset selection for training ML models on hard-to-classify patterns<\/a><\/li><li><a href=\"https:\/\/www.spiedigitallibrary.org\/conference-proceedings-of-spie\/11614\/116140T\/Applying-machine-learning-methods-to-accelerate-advanced-process-node-yield\/10.1117\/12.2584008.full\" target=\"_blank\" rel=\"noreferrer noopener\">Applying machine learning methods to accelerate advanced process node yield ramp<\/a><\/li><li><a href=\"https:\/\/www.spiedigitallibrary.org\/conference-proceedings-of-spie\/11614\/116140Y\/Guard-banding-of-IP-against-topography-sensitivity-using-silicon-calibrated\/10.1117\/12.2585488.full\" target=\"_blank\" rel=\"noreferrer noopener\">Guard-banding of IP against topography sensitivity using silicon calibrated CMP model<\/a><\/li><li><a href=\"https:\/\/www.spiedigitallibrary.org\/conference-proceedings-of-spie\/11609\/1160917\/Gaussian-random-field-EUV-stochastic-models-their-generalizations-and-lithographically\/10.1117\/12.2583792.full\" target=\"_blank\" rel=\"noreferrer noopener\">Gaussian Random Field EUV stochastic models, their generalizations and lithographically meaningful stochastic metrics<\/a><\/li><\/ul>\n\n\n\n<p>If you\u2019re interested in learning more about our work in any of these fields, let us know! Call us at 1-800-547-3000, or <a href=\"https:\/\/resources.sw.siemens.com\/en-US\/contact-eda\" target=\"_blank\" rel=\"noreferrer noopener\">send us a note<\/a> telling us what topics you\u2019d like more information about.<\/p>\n\n\n\n<figure class=\"wp-block-image size-large is-resized\"><a href=\"http:\/\/linkd.in\/1fZ4vYq\" target=\"_blank\" rel=\"noopener\"><img loading=\"lazy\" decoding=\"async\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/50\/2021\/03\/followus-linkedin-gty514825956-text-overlay-300x70-1.jpg\" alt=\"LinkedIn follow button\n\" class=\"wp-image-2127\" width=\"300\" height=\"73\"\/><\/a><\/figure>\n\n\n\n<p><\/p>\n","protected":false},"excerpt":{"rendered":"<p>The SPIE Advanced Lithography Digital Forum took place Feb 22-26, and of course, Siemens EDA was there! We wouldn\u2019t miss&#8230;<\/p>\n","protected":false},"author":71645,"featured_media":2125,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[303,5],"tags":[492,689,370,711,369,511],"industry":[],"product":[90],"coauthors":[],"class_list":["post-2124","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-dfm","category-events","tag-cmp-modeling","tag-euv","tag-lithography","tag-machine-learning","tag-opc","tag-semiconductor","product-calibre"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/50\/2021\/03\/ML-closed-loop-DFM.jpg","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/posts\/2124","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/users\/71645"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/comments?post=2124"}],"version-history":[{"count":4,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/posts\/2124\/revisions"}],"predecessor-version":[{"id":2130,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/posts\/2124\/revisions\/2130"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/media\/2125"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/media?parent=2124"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/categories?post=2124"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/tags?post=2124"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/industry?post=2124"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/product?post=2124"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/coauthors?post=2124"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}