{"id":2080,"date":"2020-11-30T16:26:00","date_gmt":"2020-11-30T21:26:00","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/calibre\/?p=2080"},"modified":"2026-03-26T16:22:59","modified_gmt":"2026-03-26T20:22:59","slug":"mentor-receives-2020-tsmc-oip-partner-of-the-year-awards-for-eda-solutions","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/calibre\/2020\/11\/30\/mentor-receives-2020-tsmc-oip-partner-of-the-year-awards-for-eda-solutions\/","title":{"rendered":"Mentor receives 2020 TSMC OIP Partner of the Year awards for EDA solutions"},"content":{"rendered":"\n

By Shelly Stalnaker – Mentor, A Siemens Business<\/p>\n\n\n\n

While the structure of the TSMC OIP Ecosystem Forum had to change to an online format this year, one aspect remained the same\u2014the recognition of Mentor, a Siemens Business as a valuable TSMC partner. Mentor was the recipient of two 2020 OIP Partner of the Year awards for EDA solutions. This title is awarded to partner companies achieving the highest standards of design, development and technology implementation to accelerate silicon innovation.<\/p>\n\n\n\n

For 2020, TSMC recognized Mentor in the categories of \u201cJoint Development of 3DIC Design Productivity Solution\u201d and \u201cJoint Development of 3nm Design Infrastructure\u201d. The Calibre offering was a key element in both of these awards.<\/p>\n\n\n\n

\"\"<\/figure>\n\n\n\n

Mentor earned the 3DIC Design Productivity award based on the expanded support it provided for TSMC\u2019s 2.5\/3D offering. In addition to Xpedition\u2122 software platform enhancements for the latest variant of the TSMC InFO (Integrated Fan-Out) wafer-level packaging, our Calibre\u00ae platform 3DSTACK technology was expanded to support inter-die port connectivity checking for TSMC offerings, with support for the latest variant of CoWoS\u00ae. These changes support the additional analysis capabilities needed to manage the increasing complexity of customer designs.<\/p>\n\n\n\n

The 3nm Design Infrastructure award recognized Mentor for certifying many of its flagship EDA portfolios to run on TSMC\u2019s bleeding-edge 3nm process technology, including the Calibre\u00ae nmPlatform, which is the global IC verification industry leader.<\/p>\n\n\n\n

\u201cIt is not just the software that the Calibre group delivers, it is the entire team behind the software that make our solutions award-winning year after year. Representing the long-standing partnership the entire Calibre team maintains with TSMC is the Taiwan Calibre Product Management team, who work every day with TSMC to ensure our mutual customers continue to succeed. That is the best award!<\/em>” – Michael Buehler-Garcia, VP of Product Management, Calibre Design Solutions<\/p>\n\n\n\n

Calibre\u2019s long-standing collaboration with TSMC has been recognized over the years with multiple Partner of the Year awards.<\/em><\/strong><\/p>\n","protected":false},"excerpt":{"rendered":"

By Shelly Stalnaker – Mentor, A Siemens Business While the structure of the TSMC OIP Ecosystem Forum had to change…<\/p>\n","protected":false},"author":71645,"featured_media":2082,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[1],"tags":[507],"industry":[],"product":[90],"coauthors":[],"class_list":["post-2080","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","tag-3dic","product-calibre"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/50\/2020\/11\/pic-2.jpg","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/posts\/2080","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/users\/71645"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/comments?post=2080"}],"version-history":[{"count":5,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/posts\/2080\/revisions"}],"predecessor-version":[{"id":2782,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/posts\/2080\/revisions\/2782"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/media\/2082"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/media?parent=2080"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/categories?post=2080"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/tags?post=2080"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/industry?post=2080"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/product?post=2080"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/coauthors?post=2080"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}