{"id":1766,"date":"2019-04-05T12:10:21","date_gmt":"2019-04-05T19:10:21","guid":{"rendered":"https:\/\/blogs.mentor.com\/calibre\/?p=1766"},"modified":"2026-03-26T16:19:41","modified_gmt":"2026-03-26T20:19:41","slug":"the-power-of-innovation-letting-patterns-create-themselves-with-self-aligned-multi-patterning","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/calibre\/2019\/04\/05\/the-power-of-innovation-letting-patterns-create-themselves-with-self-aligned-multi-patterning\/","title":{"rendered":"The power of innovation: Letting patterns create themselves with self-aligned multi-patterning"},"content":{"rendered":"<p>By\u00a0David Abercrombie, Rehab Kotb Ali, Ahmed Hamed-Fatehy &#8211; Mentor, A Siemens Business<\/p>\n<p><em>Given the alignment control issues in traditional litho-etch multi-patterning processes, self-aligned multi-patterning processes have become a necessity at the most advanced nodes, regardless of the lithography technology used. Detailed, step-by-step explanations help you understand the SADP, SAQP, and SALELE processes.<\/em><\/p>\n<p><!--more--><\/p>\n<p>Have you been avoiding learning about self-aligned multi-patterning because it just seemed too\u2026abstract? Well, just as abstract artists Picasso and Pollock created new genres of art that are now widely admired and emulated, self-aligned multi-patterning is taking its place in the realm of mainstream semiconductor manufacturing processes.<\/p>\n<p><a href=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/50\/2019\/04\/SAMP-processes.jpg\"><img loading=\"lazy\" decoding=\"async\" class=\"alignright size-medium wp-image-1767\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/50\/2019\/04\/SAMP-processes-520x616.jpg\" alt=\"\" width=\"520\" height=\"616\" \/><\/a>Given the alignment control issues in traditional litho-etch multi-patterning processes, self-aligned multi-patterning processes have become a necessity at the most advanced nodes, regardless of the lithography technology used. Mentor teamed up with IMEC to provide engineers at both foundries and design houses an in-depth look at three production self-alignment processes\u2014SADP, SAQP, and SALELE. With step-by-step explanations, our joint paper explains the intricacies of self-aligned pattern creation needed to ensure pattern fidelity in today\u2019s most advanced nodes.<\/p>\n<p>Whether you\u2019re a foundry engineer, an IC designer, a verification engineer, or simply someone who wants or needs to learn more about self-aligned multi-patterning creation, this paper provides insight into the challenges, advantages, and opportunities presented by self-aligned multi-patterning techniques.<\/p>\n<p>You can access or download a copy of the paper by clicking here: <a href=\"https:\/\/www.mentor.com\/products\/ic_nanometer_design\/resources\/overview\/multi-patterning-options-for-5nm-and-below-sadp-saqp-salele-8008ef66-6bfc-4bbd-9bab-276665e67c11\/?cmpid=11722\" target=\"_blank\" rel=\"noopener noreferrer\">Multi-patterning options for 5nm and below: SADP, SAQP, SALELE<\/a><\/p>\n<p><a href=\"http:\/\/linkd.in\/1fZ4vYq\" target=\"_blank\" rel=\"noopener noreferrer\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone wp-image-637 size-full\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/50\/2015\/09\/LinkedIn-Button.jpg\" alt=\"\" width=\"300\" height=\"70\" \/><\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>By\u00a0David Abercrombie, Rehab Kotb Ali, Ahmed Hamed-Fatehy &#8211; Mentor, A Siemens Business Given the alignment control issues in traditional litho-etch&#8230;<\/p>\n","protected":false},"author":71645,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[1],"tags":[],"industry":[],"product":[],"coauthors":[],"class_list":["post-1766","post","type-post","status-publish","format-standard","hentry","category-news"],"_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/posts\/1766","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/users\/71645"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/comments?post=1766"}],"version-history":[{"count":1,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/posts\/1766\/revisions"}],"predecessor-version":[{"id":3291,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/posts\/1766\/revisions\/3291"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/media?parent=1766"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/categories?post=1766"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/tags?post=1766"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/industry?post=1766"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/product?post=1766"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/coauthors?post=1766"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}