{"id":1197,"date":"2017-02-20T09:34:38","date_gmt":"2017-02-20T16:34:38","guid":{"rendered":"https:\/\/blogs.mentor.com\/calibre\/?p=1197"},"modified":"2026-03-26T16:18:13","modified_gmt":"2026-03-26T20:18:13","slug":"what-to-see-at-spie-2017","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/calibre\/2017\/02\/20\/what-to-see-at-spie-2017\/","title":{"rendered":"What to see at SPIE 2017"},"content":{"rendered":"<p><em>It is time again for the SPIE Advanced Lithography conference.<\/em><\/p>\n<p><!--more--><\/p>\n<p>This year SPIE runs from Sunday, February 26, to Thursday, March 2 at the San Jose Convention Center. Mentor Graphics experts will be delivering conference papers, post sessions, and answering your questions in booth 221. Enter a raffle to win a Bluetooth earpiece + charging capsule at our booth.<\/p>\n<p>As always, Mentor is well represented in the technical area with 10 papers and 10 posters. You can download the list of our technical presentations <a href=\"https:\/\/www.mentor.com\/products\/ic-manufacturing\/events\/spie\" target=\"_blank\" rel=\"noopener\">here<\/a><\/p>\n<p>Mentor\u2019s presence this year is skewed to research on emerging technologies, including directed self-assembly (DSA) and multipatterning, two topics Mentor continues to invest in and develop.<\/p>\n<p>A number of the Mentor papers this year at SPIE Advanced Lithography are written jointly with leading-edge foundries that demonstrates the widespread usage and application of the Calibre tools at these various foundries<\/p>\n<p><strong>Samsung<\/strong><\/p>\n<ul>\n<li>\u201cInterlayer verification methodology for multi-patterning processes,\u201d presented March 1 at 9:50am.<\/li>\n<li>\u201cFinFET-induced anisotropy in printing of implantation shapes,\u201d presented March 2 at 11:35am.<\/li>\n<li>\u201cEarly stage hotspot analysis through standard cell base random pattern generation\u201d presented March 2 at 3:40pm.<\/li>\n<\/ul>\n<p><strong>GLOBALFOUNDRIES <\/strong><\/p>\n<ul>\n<li>\u201cEnhanced OPC recipe coverage and early hotspot detection through automated layout generation and analysis,\u201d presented March 1 at 3:20pm.<\/li>\n<li>\u201cDirected self-assembly (DSA) of Lamella-type of copolymers in self-aligned via (SAV) application from design to patterning,\u201d presented March 1 at 4:10pm.<\/li>\n<li>\u201cEffective use of aerial image metrology for calibration of OPC models,\u201d presented March 2 at 8:40am.<\/li>\n<\/ul>\n<p><strong>SMIC\u00a0<\/strong><\/p>\n<ul>\n<li>\u201cLithography and OPC friendly triple patterning decomposition method for via,\u201d in the March 1 poster session.<\/li>\n<li>\u201cA random approach of pattern library creation for full chip litho-simulation,\u201d in the March 1 poster session.<\/li>\n<li>\u201cLayout decomposition and analysis using pattern matching,\u201d in the March 1 poster session.<\/li>\n<li>\u201cA flexible and efficient way to set-up QA system based on pattern database management,\u201d in the March 1 poster session.<\/li>\n<li>\u201cAn efficient way of layout processing based on pattern matching for defects inspection application,\u201d in the March 1 poster session.<\/li>\n<li>\u201cA fast and efficient method for device level layout analysis,\u201d in the March 1 poster session.<\/li>\n<\/ul>\n<p><strong>STMICROELECTRONICS<\/strong><\/p>\n<ul>\n<li>\u201cSi-photonics waveguides manufacturability using advanced RET solutions,\u201d presented March 2 at 9:40am.<\/li>\n<\/ul>\n<p><strong>Shanghai Huali Microelectronics Corp<\/strong><\/p>\n<ul>\n<li>\u201cLitho hotspots fixing using model-based algorithm,\u201d in the March 1 poster session.<\/li>\n<\/ul>\n<p>Topics at SPIE Advanced Lithography extends well past mask synthesis and RET\/OPC and into DFM, design enablement, emerging technologies, and design-technology co-optimization. Mentor is a technology leader in all these areas and has an entire post-tapeout flow built on the Calibre platform.<\/p>\n<p>&nbsp;<\/p>\n<p>&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>It is time again for the SPIE Advanced Lithography conference.<\/p>\n","protected":false},"author":71645,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[1],"tags":[],"industry":[],"product":[],"coauthors":[],"class_list":["post-1197","post","type-post","status-publish","format-standard","hentry","category-news"],"_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/posts\/1197","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/users\/71645"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/comments?post=1197"}],"version-history":[{"count":1,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/posts\/1197\/revisions"}],"predecessor-version":[{"id":3216,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/posts\/1197\/revisions\/3216"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/media?parent=1197"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/categories?post=1197"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/tags?post=1197"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/industry?post=1197"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/product?post=1197"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/calibre\/wp-json\/wp\/v2\/coauthors?post=1197"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}