By Derong Yan – Mentor, A Siemens Business
Meeting tapeout schedules and performance requirements are equally critical conditions for IC design success. Now engineers can do both, using innovative P2P resistance checking to find and debug ESD errors in their layouts.
Electrostatic discharge (ESD) is one of the sworn enemies of circuit verification engineers. A single surge of unexpected current can destroy circuitry in a flash (pun intended). Integrated circuit (IC) designers try to build in protection by adding ESD protection devices and discharge paths that direct unwanted current safely away from critical circuitry. However, finding, debugging, and fixing layout errors has always required significant time and resources, and it’s only gotten harder as layouts become larger and more complex. Techniques like visual inspection of layouts just aren’t practical any longer.
But if ESD discharge paths, pull-up/pull-down diodes, and point-to-point (P2P) resistance calculations figure strongly in your nightmares, there’s good news. Electronic design automation (EDA) tools are available that can automate ESD checking to help you quickly identify and fix problematic layouts. For example, the Calibre PERC reliability platform, when combined with the Calibre RVE results viewer and Calibre DESIGNrev layout viewer, enables you to not only automatically check the resistances of ESD discharge paths in an IC layout, but also quickly see a visual representation of both the total effective resistance of a path, and the contribution made by each polygon segment to that resistance. This functionality lets you immediately identify the resistance bottlenecks along an ESD path so you can make smart layout changes, such as widening metal routes or adding additional vias, that reduce the total effective resistance of the ESD path to remain within design limits.
To learn more about ESD resistance violations, and better, faster ways to find and fix them, check out our white paper, Checking ESD path resistance in IC designs