Long term reliability has always been a focus for the automotive industry but is now expanding to include other application areas, such as mobile communication and IoT. When designing ICs for these applications, long term reliability validation has become an integral step in the verification process. To satisfy their customer’s needs for accurate aging simulations, foundries face the requirement to provide corresponding aging models for accurate simulation of device degradation over time.
Fraunhofer IIS/EAS and Siemens EDA are working together to ensure mutual customers can take advantage of running aging simulations using Siemens EDA’s Analog FastSPICE (AFS) Platform through models enabled by the new CMC industry standard Open Model Interface (OMI). In this presentation, we will discuss aging challenges, history and benefits of OMI, and the methodology needed to successfully utilize this new standard.
Interested in learning more about the CMC industry standard OMI using Siemens EDA Analog FastSPICE Platform? If yes, Siemens EDA is hosting a live web seminar on Wednesday, September 8th that you will want to attend.