{"id":1542,"date":"2014-08-12T12:33:35","date_gmt":"2014-08-12T19:33:35","guid":{"rendered":"https:\/\/blogs.plm.automation.siemens.com\/t5\/Academic-News\/Executive-and-Student-Outtakes-from-the-PACE-Annual-Forum\/ba-p\/265569"},"modified":"2026-03-26T08:09:04","modified_gmt":"2026-03-26T12:09:04","slug":"executive-and-student-outtakes-from-the-pace-annual-forum","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/academic\/executive-and-student-outtakes-from-the-pace-annual-forum\/","title":{"rendered":"Executive and Student Outtakes from the PACE Annual Forum"},"content":{"rendered":"<p><P><SPAN><IMG src=\"https:\/\/siemensplm.i.lithium.com\/t5\/image\/serverpage\/image-id\/7705i1972F2704894C665\/image-size\/medium?v=mpbl-1&amp;px=-1\" border=\"0\" alt=\"pace forum logo.jpg\" title=\"pace forum logo.jpg\" align=\"left\" \/>The&nbsp;<\/SPAN><a href=\"http:\/\/pacepartners.org\/\" target=\"_blank\" rel=\"nofollow noopener noreferrer\">Partners for the Advancement of Collaborative Engineering Education (PACE)<\/A><SPAN>&nbsp;recently held its annual forum in Turin, Italy. PACE links&nbsp;GM, Autodesk, Hewlett-Packard, Siemens PLM Software and Sun Microsystems and their global operations, to support strategically selected academic institutions worldwide to develop the&nbsp;<EM>automotive product lifecycle management<\/EM>&nbsp;(PLM) team of the future.&nbsp;<\/SPAN><\/P><\/p>\n<p><P><SPAN>Students at the forum competed in the Personal Assited Mobility Device (PAMD) competition (<a href=\"http:\/\/www.pacepartners.org\/files_pub\/PAMD_Project_Brief.pdf\" target=\"_blank\" rel=\"nofollow noopener noreferrer\">PDF description<\/A>).<\/SPAN><\/P><\/p>\n<p><P><SPAN> Learn more from executives and students in these outtake blog posts:<\/SPAN><\/P><\/p>\n<p><H3><a href=\"http:\/\/blog.industrysoftware.automation.siemens.com\/blog\/2014\/08\/08\/gm-executives-inspire-future-engineers-pace-annual-forum\/\" target=\"_blank\" rel=\"nofollow noopener noreferrer\">GM Executives Inspire Future Engineers at PACE Annual Forum<\/A><\/H3><\/p>\n<p><H3><a href=\"http:\/\/blog.industrysoftware.automation.siemens.com\/blog\/2014\/08\/12\/meet-future-engineer-rodeo-star-colt-capurro\/\" target=\"_blank\" rel=\"nofollow noopener noreferrer\">Meet Future Engineer and Rodeo Star Colt Capurro<\/A><\/H3><\/p>\n","protected":false},"excerpt":{"rendered":"<p>ThePartners for the Advancement of Collaborative Engineering Education (PACE)recently held its annual forum in Turin, Italy. PACE links&nbsp;GM, Autodesk, Hewlett-Packard, Siemens PLM S&#8230;<\/p>\n","protected":false},"author":61893,"featured_media":1543,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[1],"tags":[],"industry":[],"product":[],"coauthors":[],"class_list":["post-1542","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/11\/2019\/09\/pace-forum-logo.jpg","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/academic\/wp-json\/wp\/v2\/posts\/1542","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/academic\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/academic\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/academic\/wp-json\/wp\/v2\/users\/61893"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/academic\/wp-json\/wp\/v2\/comments?post=1542"}],"version-history":[{"count":2,"href":"https:\/\/blogs.sw.siemens.com\/academic\/wp-json\/wp\/v2\/posts\/1542\/revisions"}],"predecessor-version":[{"id":1545,"href":"https:\/\/blogs.sw.siemens.com\/academic\/wp-json\/wp\/v2\/posts\/1542\/revisions\/1545"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/academic\/wp-json\/wp\/v2\/media\/1543"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/academic\/wp-json\/wp\/v2\/media?parent=1542"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/academic\/wp-json\/wp\/v2\/categories?post=1542"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/academic\/wp-json\/wp\/v2\/tags?post=1542"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/academic\/wp-json\/wp\/v2\/industry?post=1542"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/academic\/wp-json\/wp\/v2\/product?post=1542"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/academic\/wp-json\/wp\/v2\/coauthors?post=1542"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}